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     首頁(yè) > 技術(shù) > 技術(shù)文摘 > TelcoBridges 高擴(kuò)充能力的實(shí)現(xiàn):Multi-Blade

    TelcoBridges 高擴(kuò)充能力的實(shí)現(xiàn):Multi-Blade

    2005-03-28 00:00:00   作者:   來(lái)源:   評(píng)論:0 點(diǎn)擊:



      Multi-Balde采用獨(dú)有的先進(jìn)技術(shù),能夠把最多16塊TB640卡無(wú)縫的連接在一起,使得系統(tǒng)容量可以達(dá)到1024E1的超大規(guī)模。特點(diǎn):
    • CPCI外形

    • 卡間交換時(shí)的延時(shí)少于1毫秒

    • 可以使用2個(gè)Multi-Blade實(shí)現(xiàn)冗余架構(gòu)
      TelcoBridges' innovative, ultra performing System-blade is in a class of its own. It allows telecom system integrators to compete effectively by offering a tailor-made option at an extremely affordable price.

      The TelcoBridges' system-on-a-blade solution has the reliability, flexibility and superior performance to replace any 8-64 trunk telecom system with a single blade. In addition, the bridging of multiple blades can easily increase a single system capacity up to 1024 trunks using our innovative Multi-blade.

    TelcoBridges' unique TB640 System-blade offers:
    • Easy integration

    • Dynamic configuration

    • Non-blocking architecture

    • Proven flexibility

    • High availability

    • Unmatched density

    • Superior scalability
      64 to 1024 trunks …for system scaling made easy, switch to a TB-Multi-Blade

      With up to 1024 trunks in a single system... the non-blocking architecture of our Multi-blade solution provides you with a superior level of density and redundancy.

      Our unique technology allows you to bridge multiple TB640 blades together to a level never before seen in the market. It is the most flexible and powerful solution to enlarging your overall system capacity.

    Features:
    • Provides efficient transfer of voice between multiple blades

    • Less than 1ms delay when connecting through TB-Multi-blade

    • Non-Blocking architecture for up to 32,768 DS0

    • Supports redundancy
    TB640-Multi-blade SPECIFICATIONS

    Physical Interfaces

    Link Interface
    • Up to 16 links to the TB640

    • Supports 2048 channels per link

    • LVDS electrical interface
    BITS Interface
    • ITU G.703, G.775 Telecom formats
    Scalability

    Multi-blade Interconnectivity
    • Up to sixteen TB640 can be interconnected enabling up to 1024 trunks or 32,768 channels

    • Non-blocking switching between all channels
    Clock Synchronization
    • Can synchronize from any input links or local clock source with automatic fallback
    Control and Management

    Control
    • PICMG 2.16 in a dual fabric packet switched backplane (100/1000 Mbps) or Dual redundant rear panel ethernet (100/1000 Mbps)

    • Does not require cPCI CPU server blades

    • LVDS electrical interface
    Management
    • Ethernet ports or RS-232C Serial port

    • Field upgradeable software and firmware

    • Front panel push buttons for field information on 8-character display

    • Full set of APIs for management
    High Availability and Redundancy
    • Hot swap (PICMG 2.1 R2.0 Hot Swap Specifications)

    • Hot Insertion

    • 1+1 redundancy per link when two TB-Multi-blades are used
    Diagnostics
    • POST: Power On Self-Test

    • Log and status available for all modules including full performance monitoring
    Host Operating System
    • Host APIs under Solaris, Linux and Windows
    Backplane Interfaces
    • Compact PCI (PICMG 2.0, Rev 3.0)

    • PICMG 2.16 R1.0 Packet Switching Backplane Specifications (PSB)
    Mechanical
    • Compact PCI

      • 6U double slot

      • Front panel(233 x 160mm)

      • Rear panel(233 x 80mm)

      • Keying (PICMG 2.10 Rev 1.0)

    • Connectors

      • Each link is two HSSDC2 for a total of up to 32 HSSDC2 connectors

      • RJ-45 for BITS interface

      • Dual RJ-45 ethernet

      • RS232C Serial port
    Power Requirements
    • 0.82A @ 5v

    • 7.4A @ 3.3v

    • Total board power consumption less than 35w
    Environment

    Environmental
    • Operating temperature: 0 to +50C

    • ·
    • Operating humidity: 5% to 85% non-condensing

    • Storage humidity: 95% at +40C
    Safety
    • US: UL60950 (2000)

    • Europe: EN 60950 (2000)

    • International: IEC60950 (1999)
    EMC
    • FCC 47 CFR Part 15, Subpart B:1999 (class A)

    • EN55022:1998 for Class A

    • EN55024:1998
    Designed to meet NEBS-3 compliance
  • FCC 47 CFR Part 15, Subpart B:1999 (class A)
  • GR-63 Environmental specifications

  • GR-1089 EMI/EMC specifications

  • 東訊博瑞公司供稿 CTI論壇編輯

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