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高擴充能力的實(shí)現：Multi-Blade

2005/03/28

• CPCI外形


• 卡間交換時(shí)的延時(shí)少于1毫秒


• 可以使用2個(gè)Multi-Blade實(shí)現冗余架構

• Easy integration


• Dynamic configuration


• Non-blocking architecture


• Proven flexibility


• High availability


• Unmatched density


• Superior scalability

• Provides efficient transfer of voice between multiple blades


• Less than 1ms delay when connecting through TB-Multi-blade


• Non-Blocking architecture for up to 32,768 DS0


• Supports redundancy

• Up to 16 links to the TB640


• Supports 2048 channels per link


• LVDS electrical interface

• ITU G.703, G.775 Telecom formats

• Up to sixteen TB640 can be interconnected enabling up to 1024 trunks or 32,768 channels


• Non-blocking switching between all channels

• Can synchronize from any input links or local clock source with automatic fallback

• PICMG 2.16 in a dual fabric packet switched backplane (100/1000 Mbps) or Dual redundant rear panel ethernet (100/1000 Mbps)


• Does not require cPCI CPU server blades


• LVDS electrical interface

• Ethernet ports or RS-232C Serial port


• Field upgradeable software and firmware


• Front panel push buttons for field information on 8-character display


• Full set of APIs for management

• Hot swap (PICMG 2.1 R2.0 Hot Swap Specifications)


• Hot Insertion


• 1+1 redundancy per link when two TB-Multi-blades are used

• POST: Power On Self-Test


• Log and status available for all modules including full performance monitoring

• Host APIs under Solaris, Linux and Windows

• Compact PCI (PICMG 2.0, Rev 3.0)


• PICMG 2.16 R1.0 Packet Switching Backplane Specifications (PSB)

• Compact PCI


• 6U double slot


• Front panel(233 x 160mm)


• Rear panel(233 x 80mm)


• Keying (PICMG 2.10 Rev 1.0)


• Connectors


• Each link is two HSSDC2 for a total of up to 32 HSSDC2 connectors


• RJ-45 for BITS interface


• Dual RJ-45 ethernet


• RS232C Serial port

• 0.82A @ 5v


• 7.4A @ 3.3v


• Total board power consumption less than 35w

• Operating temperature: 0 to +50C

·
• Operating humidity: 5% to 85% non-condensing


• Storage humidity: 95% at +40C

• US: UL60950 (2000)


• Europe: EN 60950 (2000)


• International: IEC60950 (1999)

• FCC 47 CFR Part 15, Subpart B:1999 (class A)


• EN55022:1998 for Class A


• EN55024:1998

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